Intel's collaboration with UNSLAN influence NAND price trend
Intel and meguiar's has announced that it will at the completion of the third generation of 3 d NAND Flash terminated after research and development cooperation, each looking for partners, reportedly Intel and UNSLAN is actively developing the follow-up cooperation plan, sales are expected to establish a formal cooperation relationship. This strategy, which is expected to be used at a lower price for chromebooks or other consumer electronics, is likely to change the overall price trend for NAND Flash.
Intel and meguiar's at present to develop both sides of the second generation product for 64 layer 3 d NAND Flash, the third generation is expected to 96 layer stackable, representing 96 layer after 3 d NAND Flash product research and development, Intel will formally parted ways with micron; This resolution will not have a significant impact on the subsequent process improvement and product planning, but will have greater flexibility to seek new partners after the separation.
Intel has been paid close attention to the Chinese market, in areas such as CPU, memory, modem are actively seeking different cooperation or joint venture opportunities, and continue to expand production capacity in China, included in China's dalian area is given priority to with 3 d NAND independent capacity will continue to expand.
Intel recently with the Chinese UNSLAN are actively to formulate long-term contracts, UNSLAN in the future will obtain a certain proportion from the Intel NAND wafer, after encapsulation testing into different products by itself, by the UNSLAN has its own path.
Observe the layout of the flash memory in the UNSLAN, mainly responsible for the development and design and production of the flash memory in the Yangtze river, and responsible for the sales of UNSLAN; But currently store the design of the Yangtze river NAND Flash products still give priority to with 32 layer, so the official developed 64 layer or a higher number of products in the past, purple light storage in order to maintain channel marketing competitiveness, through agreement each month since the Intel made Flash memory wafer, finished product packaging again to contain it, eMMC and SSD products.
UNSLAN through the cooperation, in addition to maintain channel competitiveness, also can enhance brand visibility, although initially couldn't cut into the high-end smartphone, or get advantages in the field of client SSD, but these policies will be able to contain low price cut into this or other consumer electronics applications, follow-up could bring about NAND Flash overall price movements.
Intel and meguiar's at present to develop both sides of the second generation product for 64 layer 3 d NAND Flash, the third generation is expected to 96 layer stackable, representing 96 layer after 3 d NAND Flash product research and development, Intel will formally parted ways with micron; This resolution will not have a significant impact on the subsequent process improvement and product planning, but will have greater flexibility to seek new partners after the separation.
Intel has been paid close attention to the Chinese market, in areas such as CPU, memory, modem are actively seeking different cooperation or joint venture opportunities, and continue to expand production capacity in China, included in China's dalian area is given priority to with 3 d NAND independent capacity will continue to expand.
Intel recently with the Chinese UNSLAN are actively to formulate long-term contracts, UNSLAN in the future will obtain a certain proportion from the Intel NAND wafer, after encapsulation testing into different products by itself, by the UNSLAN has its own path.
Observe the layout of the flash memory in the UNSLAN, mainly responsible for the development and design and production of the flash memory in the Yangtze river, and responsible for the sales of UNSLAN; But currently store the design of the Yangtze river NAND Flash products still give priority to with 32 layer, so the official developed 64 layer or a higher number of products in the past, purple light storage in order to maintain channel marketing competitiveness, through agreement each month since the Intel made Flash memory wafer, finished product packaging again to contain it, eMMC and SSD products.
UNSLAN through the cooperation, in addition to maintain channel competitiveness, also can enhance brand visibility, although initially couldn't cut into the high-end smartphone, or get advantages in the field of client SSD, but these policies will be able to contain low price cut into this or other consumer electronics applications, follow-up could bring about NAND Flash overall price movements.