Intel's upcoming subminiature 1 TB BGA SSD
SSD will become more and more small, foreign media Tom 's latest Hardware receive a new message, said Intel will be issued a new 1 TB BGA SSD SSD products, with Toshiba and Samsung also USES the MCP chip packaging technology, the 3 d NAND will be up to 1 TB of capacity.
Tom 's Hardware showed a by Intel's picture, the picture has three Intel's products, the introduction of image said: "the most on the left is the first generation of 1 TB 2016 3 d NAND SSD, launched in 2017, is among the second generation of 1 TB 3 d NAND, the right is what is the 3 d NAND will launch next year TB." According to the picture, the three products represent 2.5 "SATA3, M.2 and BGA encapsulated SSD products.
However, BGA encapsulation of SSD product size and pin number show that it is not a simple NAND encapsulation, new BGA encapsulation compared with Intel 600 p SSD (2) on the NAND Flash is larger and would be identified as MCP SSD encapsulation, volume according to the standard 1620 (16 mm x 20 mm), 2024 (20 mm x 24 mm), 2228 (22 mm x 28 mm), 2828 (28 mm x 28 mm) four, Toshiba and Samsung has built 1620 of BGA encapsulation BG3 SSD, SATA 6 gb/s transmission with two/four PCIe 3.0 channel (supposedly NVMe).
A single BGA package can be installed on the standard M.2 PCB or motherboard. The Toshiba BG3 SSD is connected by PCIe 3.0 x2, which has a capacity of 512GB and supports the Host Memory Buffer (HMB) Host Memory Buffer. HMB function can significantly improve system memory utilization, reduce total system cost, reduce power consumption, and provide consumer new action computing device category.
Although it is not clear whether Intel will HMB technology combined with BGA SSD, compared with the Package - On - Package (PoP) with seal design, HMB can reduce cost, no need to integrate DRAM as a buffer pool. And at the same time HMB support built-in Windows and Linux 10, therefore does not require additional drivers or software.
Intel file also hinted at IMFT (Intel/Micron Flash technology) new 64 layers of 512 gbit NAND die schedule (64 gb), Intel can in each package stack up to 16 NAND chips, but it will only in the existing 256 gb (32 gb) chip to create a 512 gb encapsulation. Intel's NAND manufacturing partners Mircon has confirmed that will provide greater die capacity for storage products series, will be 64 layer Intel or will need more 512 gbit die and use 16 die set of single package reaches 1 TB of capacity.
There is no information on the product of BGA SSD, and the unknown will be announced at the upcoming 2018 CES conference.
Tom 's Hardware showed a by Intel's picture, the picture has three Intel's products, the introduction of image said: "the most on the left is the first generation of 1 TB 2016 3 d NAND SSD, launched in 2017, is among the second generation of 1 TB 3 d NAND, the right is what is the 3 d NAND will launch next year TB." According to the picture, the three products represent 2.5 "SATA3, M.2 and BGA encapsulated SSD products.
However, BGA encapsulation of SSD product size and pin number show that it is not a simple NAND encapsulation, new BGA encapsulation compared with Intel 600 p SSD (2) on the NAND Flash is larger and would be identified as MCP SSD encapsulation, volume according to the standard 1620 (16 mm x 20 mm), 2024 (20 mm x 24 mm), 2228 (22 mm x 28 mm), 2828 (28 mm x 28 mm) four, Toshiba and Samsung has built 1620 of BGA encapsulation BG3 SSD, SATA 6 gb/s transmission with two/four PCIe 3.0 channel (supposedly NVMe).
A single BGA package can be installed on the standard M.2 PCB or motherboard. The Toshiba BG3 SSD is connected by PCIe 3.0 x2, which has a capacity of 512GB and supports the Host Memory Buffer (HMB) Host Memory Buffer. HMB function can significantly improve system memory utilization, reduce total system cost, reduce power consumption, and provide consumer new action computing device category.
Although it is not clear whether Intel will HMB technology combined with BGA SSD, compared with the Package - On - Package (PoP) with seal design, HMB can reduce cost, no need to integrate DRAM as a buffer pool. And at the same time HMB support built-in Windows and Linux 10, therefore does not require additional drivers or software.
Intel file also hinted at IMFT (Intel/Micron Flash technology) new 64 layers of 512 gbit NAND die schedule (64 gb), Intel can in each package stack up to 16 NAND chips, but it will only in the existing 256 gb (32 gb) chip to create a 512 gb encapsulation. Intel's NAND manufacturing partners Mircon has confirmed that will provide greater die capacity for storage products series, will be 64 layer Intel or will need more 512 gbit die and use 16 die set of single package reaches 1 TB of capacity.
There is no information on the product of BGA SSD, and the unknown will be announced at the upcoming 2018 CES conference.