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Your position:Home > News Center > WD: the 96-layer 3D flash memo.....

WD: the 96-layer 3D flash memory product has been delivered

In the first two days, WD held a meeting to discuss the details of the agreements with Toshiba, while WD also reported on the production status of BiCS 3 and BiCS 4 3D NAND flash memory. Western data set a goal before, in the hope that this year the BiCS 3 technology in the production of 64 layer 3 d NAND flash memory physical account for 3 d NAND flash memory 75% of production, but now that number is expected to can increase to more than 90%. Another set of data shows that the WD hadn't completely from the flash memory type 2 d NAND converted into 3 d NAND, 3 d NAND flash memory now only account for 65% of the total output, in other words all of WD flash memory is kind of a third is a 2 d NAND flash memory.

In addition, on the 12th of this month, WD 96 announced the BiCS4 technology layer 3 d NAND flash memory has been shipped to retailers, as early as the end of June, we have learned that the BiCS WD 4 flash memory will not only have a TLC type, and there will be QLC. TLC BiCS four techniques used for flash memory chip and adopts the BiCS 3 TLC is no any difference in flash memory chips, which contains 256 gb and 256 gb two types of specifications, but using the BiCS 4 QLC storage chip can also have a 768 gb even 1 TB this two specifications.

At the same time WD said in their PPT NAND process from 2 d to 3 d NAND process is cumbersome, they also think the plan execution time than the scheduled time delay for about 6 months, but flash memory thoroughly from 2 d to 3 d continuous process of flash memory will not use too long time. In the trend of 2 d to 3 d now, some manufacturers have used in the production of 2 d upgraded to produce DRAM and NAND of devices, not upgraded to produce 3 d NAND device, don't know what WD can draw lessons from this line of thinking.